References
Optional reading for the SEM/FIB lessons and simulation.
How SEM works
- JEOL, Scanning Electron Microscope A to Z, undated accessible edition, pp. 3–7 and 15
- JEOL, Schottky-emission electron gun, undated glossary
- JEOL, Virtual source, undated glossary
- JEOL, Electrostatic lens, undated glossary
- JEOL, Electron lens, undated glossary
- JEOL, Condenser lens, undated glossary
- JEOL, Energy spread, undated glossary
- Microscopy Australia, MyScope: Scanning Electron Microscopy, undated PDF edition
- JEOL, Secondary electron, SE, undated glossary
- JEOL, SE2, undated glossary
- JEOL, Backscattered electron detector, undated glossary
- JEOL, SED / ET detector, undated glossary
- JEOL, Through-the-lens detector, undated glossary
- NIST, NIST Study Aims to Improve Utility of the Scanning Electron Microscope, 25 April 2025, updated 28 April
- JEOL, Depth of focus, undated glossary
- Antonis Nanakoudis, Thermo Fisher Scientific, How Scanning Electron Microscopy Works, 14 November 2019
- JEOL, Charging phenomenon, undated glossary
- JEOL, Low-vacuum SEM, undated glossary
- NIST, Digital Imaging for Scanning Electron Microscopy
SEM imaging assessment
Numerical pass tolerances are MVLscope task criteria, not manufacturer specifications or a qualification standard.
SEM focusing and display
The assessment uses a separate synthetic target with curved and diagonal detail. Focusing at 0.5–1 µm field width is allowed before returning to the 2–4 µm capture field. Voxel dimensions and the assessment tolerances are teaching choices, not instrument calibration. The aperture-to-angle factor and detector display scales are illustrative. Signal gain multiplies the calculated signal; Contrast stretch scales values around grey level 110/255. Human validation of the revised focusing task remains pending.
- JEOL: Astigmatism correction — through-focus directional changes.
- UCSB NanoFab: JEOL IT800SHL imaging guidance — use features with varied edge directions for focusing and stigmation. Instrument-specific instructions are not MVLscope operating procedures.
FIB modelling
The Steel sputter yield (0.29 µm³/nC), the Pt-deposit material sputter yield and the Pt-containing deposition growth parameters are illustrative model values, not calibrated material data. The material sputter yield and the deposition growth law are separate quantities. The accumulated exposure index uses the disclosed field, pattern and fixed lamella reference areas; it is not a local spatial dose map.